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SMIC hit 10 billion US dollars storm 14nm technology is expected to 2019 production

oemie Original Equipment Manufacturer

SMIC hit 10 billion US dollars storm 14nm technology is expected to 2019 production

SMIC announced on the evening of January 30 that it will jointly invest 10.22 billion U.S. dollars in conjunction with the National Integrated Circuit Fund and the Shanghai Integrated Circuit Fund to speed up R & D and mass production of advanced manufacturing processes at 14nm and below.

SMIC announces that SMIC South will introduce SMIC Holdings, National IC Fund and Shanghai IC Fund. The three parties agreed to inject 1.54 billion U.S. dollars, 9.47 billion U.S. dollars and 800 million U.S. dollars respectively into SMIC South, Of its registered capital increased from 210 million U.S. dollars to 3.5 billion U.S. dollars, while the shareholding proportions of the three parties were 50.1%, 27.04% and 22.86% respectively. 7mbr150vr120-50

According to a report by Reuters, the contracting parties' total investment in SMIC is estimated to be 10.24 billion U.S. dollars, and the difference between the 3.5 billion U.S. dollars of registered capital and the post-capital injection plan is to be financed through debt financing.

SMIC is principally engaged in the manufacturing of integrated circuit chips, pin probing and bump fabrication, technology development, design services, fabrication of photomasks, assembly and final testing of integrated circuits, and the sale of self-produced products. SMIC is expected to set up and establish a large capacity and focus on manufacturing technologies of 14nm and below with the goal of producing 30,000 wafers per month. ixxn110n65c4h1

SMIC said: "By establishing a 12-inch wafer fab with a joint venture with the National Integrated Circuit Fund and the Shanghai Integrated Circuit Fund, the Company can expedite the introduction of advanced manufacturing processes and products with the support of the government industrial funds as well as reduce The huge cash investment and huge depreciation costs of the Company due to the expansion of advanced process capacity. "

SMIC offers foundry and technical services from 0.35um to 28nm, a 300mm fab and a 200mm fab in Shanghai, a 300mm fab and the second in Beijing Holding the development of 300mm advanced process fabs; in Tianjin and Shenzhen, respectively, built a 200mm wafer fab.

October 16, 2017 After SMIC held the interim board, announced that Liang Mengsong served as co-CEO. SMIC chairman Zhou Zixue said that Zhao Haijun and Liang Mengsong joined SMIC's board of directors as executive directors and co-CEOs together. They look forward to strengthening SMIC's ability to make technical plans through the addition of Liang Mingsong, International high-end process technology gap.

SMIC also appointed a CTO post by Zhou Meisheng, she used to be Leong Mengsong when general manager of TSMC, the future under the leadership of Liang Mengsong, will be fully skipped to 14-nanometer FinFET process.

For the outside world asked Liang Mengsong to join SMIC's biggest task, as we all know is the progress of high-end process technology. SMIC said it will mass-produce 14-nanometer FinFET process technology in 2019. In other words, Liang Mingsong use two years to help SMIC to 14-nanometer FinFET process generation to catch up.

Liang Mengsong, aged 65, graduated from the University of California, Berkeley with a Ph.D. degree in electrical engineering and computer science. He has been in the semiconductor industry for over 33 years and is engaged in the development of memory and advanced logic process technologies. With more than 450 semiconductor patents, Has published more than 350 technical papers.


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